Printed Electronics Insights: Smart Packaging and IoT
Together with the OE-A, the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion, co-sponsored by FlexTech. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company tours and a networking reception on the day before, joining participants of the 41st OE-A Working Group Meeting (Oct. 10-11, 2017).
Topics covered will include:
- Smart packaging for mass markets
- Fuelling the Internet of Everything through printed electronics
- Electronics on paper
- Smart Labels for environmental sensing
- Flexible Power for the IoT
- Scaling up active and intelligent packaging
Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.
We are proud to have Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Further details of the programme are given below.
Registration is now open. OE-A and FlexTech members will receive a discount on ticket prices.
£100 (OE-A members, FlexTech members)
For questions, please contact email@example.com
Find more information about the event here.