Germany-Japan Joint Workshop “Semiconductor Packaging, aiming to integrate with printed electronics”
On 14 September 2026, the Germany-Japan Joint Workshop “Semiconductor Packaging, aiming to integrate with printed electronics” will take place in Kumamoto as part of the Germany-Japan delegation visit. The workshop is organised by JETRO together with Fraunhofer EMFT, Fraunhofer IZM, Yamagata University, Kumamoto University and TSMC. The delegation’s visit will take place from 11 September to 19 September 2026
The workshop will bring together companies and research organisations from Germany and Japan to explore new opportunities for collaboration in applied technology development. Discussions will focus on innovative semiconductor packaging concepts, their integration with printed electronics, and pathways towards commercialisation. The programme also includes visits to Yamagata University, showcasing research in flexible electronics, printed electronics and sensing, as well as a company visit to MEKTEC, a pioneer in flexible printed circuit manufacturing.
Companies are warmly invited to join the delegation and present their expertise while exploring potential partnerships with Japanese organisations. Please note that participation is at the company’s own expense, including all travel and accommodation costs.