IRSP 2023
17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics „Stress workshop“
IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion “Reliability of Automotive Electronics”. A valuable asset of the workshop-like conference was that participants from academia, from semi industry and from equipment suppliers (mainly for characterization) attended the conference, and that we had much time for discussions.
When? 24. – 26. April 2023
Where? Hotel Elbresidenz, Bad Schandau, Germany
Scope:
Traditionally, this series of conferences has been focused on stress arising in micro- and nano-scale structures of on-chip interconnect stacks and advanced packaging structures. This thermomechanical stress can lead to degradation phenomena such as crack propagation caused by chip-package interaction and to the acceleration of known reliability-limiting processes in backend-of-line stacks such as electromigration and time-dependent dielectric breakdown. The 17th conference will include two new focus areas:
- Reliability at harsh environments (e.g. space, automotive),
- Materials behavior and reliability of organic and flexible electronics
The conference will cover the whole range from fundamental research to industrial applications. It will provide a forum for scientists and engineers from universities, research institutions and industry to discuss current challenges and future scenarios related to reliability and stress-induced phenomena in micro- and nanoelectronics.