KJLC® Awarded a Patent for its Atomic Layer Deposition System and Process

Patented ALD reactor with plasma enhancement © Kurt J. Lesker

Articel from INNOVATE, technical information resource by Kurt J. Lesker Company® 28.11.2017

The Kurt J. Lesker Company® (KJLC®), a global manufacturer of vacuum systems, thin film deposition tools and vacuum components, today announced that the United States Patent and Trademark Office has issued US patent number 9,695,510, ‚Atomic Layer Deposition Apparatus and Process‘, covering the design of an atomic layer deposition system and the process to use that system to deposit highly precise and conformal thin films. This proprietary technology substantially reduces the interaction of various precursor gas molecules with the internal surfaces of the reaction chamber and enables actual focusing of gas streams to more effectively coat the surface of arbitrarily large substrates.

Read the complete press release here.

Veröffentlicht am

29. Nov. 2017

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