The Single Largest Semiconductor Packaging Conference in Europe
we are proud to announce the 7th Electronics System-Integration Technology Conference (ESTC 2018), the upcoming premier IEEE-EPS electronics packaging conference in Europe, to be held from September 18th to 21st in Dresden, Germany.
ESTC has finally received more than 200 abstracts from around the world. This promises an interesting technical program for the conference.
Other highlights are:
- 4 Professional Development Courses.
- Keynote Presentations from Robert Bosch Semiconductor Manufacturing Dresden GmbH, Center Automotive Research of University Duisburg-Essen and Infineon Technologies.
- Industrial exhibition with currently already 26 exhibitors registered.
- Special workshops about roadmaps, fan-out, autonomous driving and more.
- Interesting industrial tours to local companies and research institutes.
- Social events along the conference timeline for discussions and networking.
Read all details here: https://www.estc-conference.net/estc-2018/estc2018-at-a-glance/
Don’t miss that event. Register today https://www.estc-conference.net/estc-2018/registration/