Pilot line(s) for 2D materials-based devices (RIA)

Pilot line(s) for 2D materials-based devices (RIA)

Projects are expected to contribute to the following outcomes:

Broadly accessible pilot line(s) fostering the creation of electronic and photonic devices and systems (co-)integrating two-Dimensional Materials (2DM).
Significant progress towards the adoption of the 2DM in the silicon and semi-conductor arena by allowing the production of new (co-)integrated devices and systems in a quality controlled way.

Opening Date: 15. November 2023

Deadline date: 19. March 2024