Pilot line(s) for 2D materials-based devices (RIA)
Projects are expected to contribute to the following outcomes:
- Broadly accessible pilot line(s) fostering the creation of electronic and photonic devices and systems (co-)integrating two-Dimensional Materials (2DM).
- Significant progress towards the adoption of the 2DM in the silicon and semi-conductor arena by allowing the production of new (co-)integrated devices and systems in a quality controlled way.
Opening Date: 15. November 2023
Deadline date: 19. March 2024