Geformte 3D-Elektronik auf K-Messe

Fraunhofer IVV zeigt innovativen Ansatz auf dem Science Campus der K-Messe 2019 in Düsseldorf

Fraunhofer IVV was selected as one of 25 companies with the innovative approach of molded electronics to present itself at the Science Campus of K trade fair 2019 in Düsseldorf.
The Science Campus sees itself as a platform for research and industry for the plastics and rubber sectors, presenting groundbreaking technologies and solutions.
The forming technology developed at the Fraunhofer IVV, Dresden as part of a joint project is based on the fact that a substrate is initially produced in a planar state using established printing and assembly technologies and that the 3D geometry is only produced by forming in the final processing step. This enables the cost-effective production of interactive (operating) surfaces with high demands on ergonomics, design and functionality in the fields of robotics, home, medical technology, automotive and aviation.
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