The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.
Registration will open soon – Stay tuned!
2019 MAIN TOPICS & HIGHLIGHTS
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Active and passive interposers
- Stacked dies or stacked wafers
- 3D alternative technologies
- 5G Integration
- Invited speakeand Keynotes
- Exhibition area
- Networking opportunities
- 30 high-caliber speakers inited
- Great networking opportunities
- exhibition zone
Find more information about the conference here.