Just a few hours instead of weeks: Hyperspectral vision speeds up barrier foil inspection - Fraunhofer IWS

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03-16-2021

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KI and HSI enable new inspection system to quickly measure foil quality for organic electronics with high spatial resolution

All over the world, researchers are focusing on protecting organic light-emitting diodes, solar cells and circuits against humidity and other harmful environmental impacts by using improved foils. The idea is to make organic electronics components more robust and thus more durable. At the “LOPEC” trade fair in March 2021, the Fraunhofer Institute for Material and Beam Technology IWS Dresden is presenting a concept that will, in future, check the quality of these barrier foils during production – until now these analyses have required up to several weeks. The new Fraunhofer IWS system is based on hyperspectral imaging and artificial intelligence (AI).

Organic electronics already provide beautiful rich colors in modern televisions, enable elegant designer lamps and are the characteristics of high-end smartphones. Organic electronics require very little power, are extremely thin, and are often even transparent and flexible. In the near future, this technology is likely to generate many more innovative consumer products, medical devices and photovoltaic applications. Material and surface inspection, for which hyperspectral imaging (HSI) is a perfect tool, may play an important role in their manufacturing process. Fraunhofer IWS has further advanced the technology in order to design the “imanto®” platform.

For more information about HSI – furthermore about imanto® and the HiBarSens technology – please visit our exhibitor profile at LOPEC 2021.

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