Shaped 3D electronics presented at K trade fair

Published on

10-02-2019

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www.ivv.fraunhofer.de

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Fraunhofer IVV zeigt innovativen Ansatz auf dem Science Campus der K-Messe 2019 in Düsseldorf

Fraunhofer IVV was selected as one of 25 companies with the innovative approach of molded electronics to present itself at the Science Campus of K trade fair 2019 in Düsseldorf.

The Science Campus sees itself as a platform for research and industry for the plastics and rubber sectors, presenting groundbreaking technologies and solutions.

The forming technology developed at the Fraunhofer IVV, Dresden as part of a joint project is based on the fact that a substrate is initially produced in a planar state using established printing and assembly technologies and that the 3D geometry is only produced by forming in the final processing step. This enables the cost-effective production of interactive (operating) surfaces with high demands on ergonomics, design and functionality in the fields of robotics, home, medical technology, automotive and aviation.

For more information please visit our website: www.ivv.fraunhofer.de/formprozesse