![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/05\/IRSP-2023-Opening-1024x577.jpg\")
<\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/05\/IRSP-2023-Hiking-1024x577.jpg\")
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Abstract Booklet<\/strong><\/a><\/div>\n<\/div>\n<\/div>\n\n\n\n
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Program<\/strong><\/a><\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n
<\/div>\n\n\n\n
\nCo-Chairs<\/h2>\n\n\n\n
Co-Chairs<\/h2>\n\n\n\n\n- Ehrenfried Zschech, deepXscan Dresden & Technische Universit\u00e4t Dresden, Germany<\/li>\n\n\n\n
- Reinhold Dauskardt, Stanford University, Palo Alto\/CA, USA<\/li>\n\n\n\n
- Valeriy Sukharev, Mentor Graphics \/ Siemens EDA, Fremont\/CA, USA<\/li>\n\n\n\n
- Olivier Thomas, Aix-Marseille Universite, France<\/li>\n\n\n\n
- Zhong Chen, NTU Singapore<\/li>\n<\/ul>\n\n\n\n
Scientific Committee<\/h2>\n\n\n\n\n- Alex Dommann, EMPA, Switzerland<\/li>\n\n\n\n
- Martin Gall, GLOBALFOUNDRIES Malta\/NY, USA<\/li>\n\n\n\n
- Chee Lip Gan, NTU Singapore<\/li>\n\n\n\n
- Goeran Jerke, Bosch Stuttgart, Germany <\/li>\n\n\n\n
- Junichi Koike, Tohoku University, Sendai, Japan<\/li>\n\n\n\n
- Jens Lienig, Technical University Dresden, Germany<\/li>\n\n\n\n
- Zhiyong Ma, Intel, Hillsboro\/OR, USA<\/li>\n\n\n\n
- Jon Molina, IMDEA Materials, Madrid, Spain<\/li>\n\n\n\n
- Stephane Moreau, Leti Grenoble, France<\/li>\n\n\n\n
- Luu Nguyen, Psi Quantum, Palo Alto\/CA, USA<\/li>\n\n\n\n
- Natalia Sobczak, IMIM PAN Cracow, Poland<\/li>\n\n\n\n
- Oden Warren, Bruker, Minneapolis\/MN, USA<\/li>\n\n\n\n
- Ingrid de Wolf, IMEC Leuven, Belgium<\/li>\n\n\n\n
- Xiaopeng Xu, Synopsys, Mountain View\/CA, USA<\/li>\n<\/ul>\n\n\n\n
Organizing Committee<\/h2>\n\n\n\n\n- Dominik Gronarz, Organic Electronics Saxony, Dresden, Germany<\/li>\n\n\n\n
- Kim Brendel, Hotel Elbresidenz, Bad Schandau, Germany<\/li>\n\n\n\n
- Kristina Kutukova, deepXscan GmbH, Dresden, Germany<\/li>\n\n\n\n
- Johann Zeller, student, Dresden, Germany<\/li>\n<\/ul>\n<\/div>\n\n\n\n\n
Sponsors<\/strong><\/h2>\n\n\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/02\/Logo_Bruker-1024x576.png\")
<\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/02\/Logo-Huber-1024x576.png\")
<\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2022\/11\/Logo_deepXscan3-1024x576.png\")
<\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/02\/Logo_Siemens-1024x576.png\")
<\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/03\/Logo_Tescan-1024x575.png\")
<\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2023\/02\/Logo-Blank-1024x576.png\")
<\/figure>\n<\/figure>\n<\/div>\n<\/div>\n\n\n\n\nOrganizers<\/strong><\/h2>\n\n\n\n\n<\/a><\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2022\/11\/Logo_OES2-1024x576.png\")
<\/a><\/figure>\n\n\n\n![\"\"](\"https:\/\/oes-net.de\/irsp2023\/wp-content\/uploads\/2022\/11\/Logo_elbresidenz3-1024x576.png\")
<\/a><\/figure>\n<\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics„Stress workshop“ IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion \u201cReliability of Automotive Electronics\u201d. A valuable asset of … <\/p>\n
Scientific Committee<\/h2>\n\n\n\n\n- Alex Dommann, EMPA, Switzerland<\/li>\n\n\n\n
- Martin Gall, GLOBALFOUNDRIES Malta\/NY, USA<\/li>\n\n\n\n
- Chee Lip Gan, NTU Singapore<\/li>\n\n\n\n
- Goeran Jerke, Bosch Stuttgart, Germany <\/li>\n\n\n\n
- Junichi Koike, Tohoku University, Sendai, Japan<\/li>\n\n\n\n
- Jens Lienig, Technical University Dresden, Germany<\/li>\n\n\n\n
- Zhiyong Ma, Intel, Hillsboro\/OR, USA<\/li>\n\n\n\n
- Jon Molina, IMDEA Materials, Madrid, Spain<\/li>\n\n\n\n
- Stephane Moreau, Leti Grenoble, France<\/li>\n\n\n\n
- Luu Nguyen, Psi Quantum, Palo Alto\/CA, USA<\/li>\n\n\n\n
- Natalia Sobczak, IMIM PAN Cracow, Poland<\/li>\n\n\n\n
- Oden Warren, Bruker, Minneapolis\/MN, USA<\/li>\n\n\n\n
- Ingrid de Wolf, IMEC Leuven, Belgium<\/li>\n\n\n\n
- Xiaopeng Xu, Synopsys, Mountain View\/CA, USA<\/li>\n<\/ul>\n\n\n\n
Organizing Committee<\/h2>\n\n\n\n\n- Dominik Gronarz, Organic Electronics Saxony, Dresden, Germany<\/li>\n\n\n\n
- Kim Brendel, Hotel Elbresidenz, Bad Schandau, Germany<\/li>\n\n\n\n
- Kristina Kutukova, deepXscan GmbH, Dresden, Germany<\/li>\n\n\n\n
- Johann Zeller, student, Dresden, Germany<\/li>\n<\/ul>\n<\/div>\n\n\n\n\n
Sponsors<\/strong><\/h2>\n\n\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n<\/figure>\n<\/div>\n<\/div>\n\n\n\n\nOrganizers<\/strong><\/h2>\n\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n<\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics„Stress workshop“ IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion \u201cReliability of Automotive Electronics\u201d. A valuable asset of … <\/p>\n
Organizing Committee<\/h2>\n\n\n\n\n- Dominik Gronarz, Organic Electronics Saxony, Dresden, Germany<\/li>\n\n\n\n
- Kim Brendel, Hotel Elbresidenz, Bad Schandau, Germany<\/li>\n\n\n\n
- Kristina Kutukova, deepXscan GmbH, Dresden, Germany<\/li>\n\n\n\n
- Johann Zeller, student, Dresden, Germany<\/li>\n<\/ul>\n<\/div>\n\n\n\n\n
Sponsors<\/strong><\/h2>\n\n\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n<\/figure>\n<\/div>\n<\/div>\n\n\n\n\nOrganizers<\/strong><\/h2>\n\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n<\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics„Stress workshop“ IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion \u201cReliability of Automotive Electronics\u201d. A valuable asset of … <\/p>\n
\nSponsors<\/strong><\/h2>\n\n\n\n
Sponsors<\/strong><\/h2>\n\n\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n<\/figure>\n<\/div>\n<\/div>\n\n\n\n\nOrganizers<\/strong><\/h2>\n\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n<\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics„Stress workshop“ IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion \u201cReliability of Automotive Electronics\u201d. A valuable asset of … <\/p>\n
<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n\n\n\n<\/figure>\n<\/figure>\n<\/div>\n<\/div>\n\n\n\n\nOrganizers<\/strong><\/h2>\n\n\n\n
Organizers<\/strong><\/h2>\n\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n<\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics„Stress workshop“ IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion \u201cReliability of Automotive Electronics\u201d. A valuable asset of … <\/p>\n
<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n\n\n\n<\/a><\/figure>\n<\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics„Stress workshop“ IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion \u201cReliability of Automotive Electronics\u201d. A valuable asset of … <\/p>\n